Views:122
Applicants:1
Posted on 24 Jul, 2025
Apply to JOBS On-The-Go Jobringer Mobile App
Key Skills- IC Package Design, Cadence APD, Flip Chip, PCB Design, High-Speed Interfaces, HDI, MCM/3D Packaging, DFM/DFA
Key Skills- Mixed-Signal IC, SERDES, Optical PHY, High-Speed Transceivers, PLL, DLL, ADC, DAC
Key Skills- CMOS memory design, SP/DP SRAM, Register File (RF), ROM design
Key Skills- VLSI, ASIC, Floorplanning, Placement, Routing, Timing Analysis, STA, EDA Tools
Key Skills- Electrical Design, Wiring Harness, Schematics, CREO, 3D Design, Electrical Integration, Product Development, NPI